Passive Wärmetauscher, die die von einem elektronischen Bauteil erzeugte Wärme auf ein flüssiges Medium (häufig Luft oder ein flüssiges Kühlmittel) übertragen und sie vom Gerät wegleiten, um eine optimale Betriebstemperatur aufrechtzuerhalten. Sie sind so konzipiert, dass die Kontaktfläche mit dem sie umgebenden Medium maximiert wird. Aufgrund ihrer hohen Wärmeleitfähigkeit bestehen sie normalerweise aus Kupfer oder Aluminium.
| Teil # | Hersteller | Beschreibung | Verfügbarkeit | Preisgestaltung | Menge |
|---|---|---|---|---|---|
CONGA-TCA7/I-HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5mm thread. | Auf Lager | - | |
CONGA-STDA4/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for SMARC Module conga-STDA4 based on TI ARM | Auf Lager | - | |
CONGA-MA7/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. | 5 | - | |
CONGA-XLX/HSP-BHeat Sinks | congatec | Heat Sinks Heatspreader for conga-XLX, standoff with 2.7mm bore hole | Auf Lager | - | |
CONGA-TCA3/CSP-THeat Sinks | congatec | Heat Sinks Standard passive cooling solution for COM Express modules conga-TCA3 and TCA4 with 20mm overall heat sink height. All standoffs are M2.5mm thread. | Auf Lager | - | |
CONGA-TC570/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. | Auf Lager | - | |
CONGA-MA5/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | Auf Lager | - | |
CONGA-TCA7/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA7 with open silicon Intel Pentium/Celeron J and N processors. All standoffs are M2.5mm thread. | Auf Lager | - | |
CONGA-HPC/CTLU-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole. | 1 | - | |
CONGA-QA7/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA7 with open-die Intel Pentium/Celeron J and N processors. All standoffs are with 2.7mm bore hole. | Auf Lager | - | |
JC370/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for conga-JC370 (bore hole). Total height 12mm. | Auf Lager | - | |
CONGA-QA5/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 5 | - | |
CONGA-TCR8/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole. | Auf Lager | - | |
TCV2/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. | Auf Lager | - | |
CONGA-QMX8/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are M2.5mm thread. | Auf Lager | - | |
CONGA-TCA5/CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. | Auf Lager | - | |
CONGA-TCR8/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded. | Auf Lager | - | |
CONGA-HPC/CTLH-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole. | Auf Lager | - | |
CONGA-QA5/I-HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. | Auf Lager | - | |
CONGA-TCA5/I-CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | Auf Lager | - | |
CONGA-MA5/I-CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 1 | - | |
HPC/SILH-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs 2.7mm. | Auf Lager | - | |
CONGA-QA3/HSP-THeat Sinks | congatec | Heat Sinks HEATSPREADER FOR conga-QA3 2.7mm | Auf Lager | - | |
CONGA-UMX6/HSP3-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for conga-UMX6 module with Non-Lidded FCBGA CPU. Stand-offs are with 2x M2.5 threaded and 2x borehole 2,7mm variants. | Auf Lager | - | |
CONGA-B7XD/HSP-CU-THeat Sinks | congatec | Heat Sinks conga-B7XD/HSP-Cu-T | Auf Lager | - |