Englisch
japanisch
Portugiesisch
Korea
Mexiko
Niederländisch
Temperatur fällt
(163 Ergebnisse)Passive Wärmetauscher, die die von einem elektronischen Bauteil erzeugte Wärme auf ein flüssiges Medium (häufig Luft oder ein flüssiges Kühlmittel) übertragen und sie vom Gerät wegleiten, um eine optimale Betriebstemperatur aufrechtzuerhalten. Sie sind so konzipiert, dass die Kontaktfläche mit dem sie umgebenden Medium maximiert wird. Aufgrund ihrer hohen Wärmeleitfähigkeit bestehen sie normalerweise aus Kupfer oder Aluminium.
| Teil # | Hersteller | Beschreibung | Verfügbarkeit | Preisgestaltung | Menge |
|---|---|---|---|---|---|
 015191Heat Sinks | congatec | Standard Heat Spreader | Auf Lager | - | |
050053Heat Sinks | congatec | Standard Heat Spreader for SMARC 2.0 Module with lidded Atom Processor | Auf Lager | - | |
050354Heat Sinks | congatec | Standard Heat Spreader for High Performance COM Express Module | Auf Lager | - | |
049455Heat Sinks | congatec | Standard Heat Spreader for COM Express Mini Type10 Module | Auf Lager | - | |
048954Heat Sinks | congatec | Heat Spreader Solution | Auf Lager | - | |
46452Heat Sinks | congatec | Heat Sink Passive | Auf Lager | - | |
47533Heat Sinks | congatec | Heat Sink Passive | Auf Lager | - | |
 CONGA-QA7/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. | Auf Lager | - | |
 CONGA-SA5/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 6 | - | |
 CONGA-MA5/CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | Auf Lager | - | |
 CONGA-QA3/CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for Qseven modules conga-QA3, QA3E and QA4. All standoffs are with 2.7mm bore hole. | Auf Lager | - | |
 CONGA-TCA5/I-HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. | Auf Lager | - | |
 CONGA-SMX8-MINI/CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for SMARC 2.0 module conga-SMX8-Mini with NXP i.MX 8M Mini ARM processor. All standoffs are with 2.7mm bore hole. | Auf Lager | - | |
 CONGA-TS170/CSA-HP-THeat Sinks | congatec | Heat Sinks Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. | Auf Lager | - | |
 CONGA-TS570/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. | Auf Lager | - | |
 CONGA-QA5/I-CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. | Auf Lager | - | |
 CONGA-TC370/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5. | Auf Lager | - | |
CONGA-MA5/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. | Auf Lager | - | |
CONGA-B7XD/HSP-CU-BHeat Sinks | congatec | Heat Sinks conga-B7XD/HSP-Cu-B | Auf Lager | - | |
 CONGA-PA7/HSP-THeat Sinks | congatec | Heat Sinks Heatspreader solution for conga-PA7 based on open silicon Intel Pentium and Celeron J and N processors . All standoffs are M2.5 thread. | Auf Lager | - | |
CONGA-TCA5/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | Auf Lager | - | |
B7XI/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Basic modules conga-B7XI with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5. | Auf Lager | - | |
 CONGA-QMX8-PLUS/HSP-BHeat Sinks | congatec | Heat Sinks Heat spreader solution for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole. | Auf Lager | - | |
CONGA-QA3/HSP-BHeat Sinks | congatec | Heat Sinks HEATSPREADER FOR conga-QA3 2.7mm | 32 | - | |
CONGA-QA7/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga QA7 with open die Intel Pentium/Celeron J and N processors. All standoffs are M2.5mm thread. | Auf Lager | - |
.png?x-oss-process=image/format,webp/resize,h_32)
